Heat Resistant Pet Protective Tape for Coating Panel

• Application: Electrical Winding Insulation
• Type: Insulation Tape
• Chemistry: Organic Insulation
• Material: Plastic
• Thermal Rating: H 180
• Maximum Voltage: 20KV~100KV
• Model NO.: JX1004
• Classification: Hybrid Insulation Materials
• Certification: ISO9001
• Color: Green
• Brand: Dupont
• Peel Strength: 700g/Inch
• Breakdown Voltage: 6kv
• Holding Powder: 24h
• Temperature Resistance: 180 Degree for Half One Hour
• Tensile Strength: 120n/mm
• Elongation: 150%
• Transport Package: Cartons
• Specification: 50mic, 80mic
• Trademark: Jiaxing
• Origin: China
• HS Code: 391990
• Production Capacity: 200000000000sqm/Month

Product Description

Green polyester tape is ideal for high-temperature masking applications in most powder coat painting, anodizing, and plating situationsan economical alternative to polymide tape.
Tape is also excellent for use as die-cut material on liner. Withstands temperatures as high as 180°C and removes cleanly from nearly all surfaces.
This tape is resistant to corrosive chemicals, tearing, and breaking. Come on a 3" diameter core.

tem	Material	Thickness	Width	Length	Temp. Resistance
Heat Resisting Tape	PET	0.06/0.08mm	15/20/30/40/50mm (other width is available)	33/66/100m	120-200ºC
Characteristics	Made from high temperature resistance polyester film, coated with imported high temperature resistant silicone pressure sensitive adhesive. With excellent high temperature performance, electrical insulation, chemical resistance, high adhesion and no glue left after tearing.
Applications	1.Use for the surface protection of high temperature painting glass, powder spray painting of aluminum alloy, the electroplating and PCB panel plating. 2.Prevent plating solution from infiltrating electronic components, prevent contamination of passive components such as plating solution droplets and steam, and shield terminal pars during soldering the circuit surface. 3.Ensure solder resistance, solvent resistance and sealing during the soldering process when electronic components are packaged on the substrate.

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